Equitment & Manufacturing
Manufacturing & Testing Equipment
Our production environment is built around a comprehensive suite of equipment that supports every stage of FPC fabrication and SMT assembly. Each machine plays a defined role in maintaining process stability, from material preparation and circuit formation through to soldering, inspection and final verification. With dedicated tools for imaging, drilling, laminating, reflow, optical inspection and electrical testing, we’re able to monitor quality in real time and keep performance consistent from samples to ongoing mass production.
Alongside our main production lines, we maintain a fully equipped inspection area that handles dimensional checks, electrical continuity, solder joint analysis and reliability assessment. This combination of manufacturing and testing systems allows us to manage each batch with traceability and confidence. The tables below provide a detailed overview of the key equipment deployed across our factory floor and quality lab.
.jpg)
| Equipment Name | Specification | Purpose / Usage |
|---|---|---|
| Constant Temperature/Humidity Test Chamber | Provides stable high temperature/humidity environment | Tests if FPC meets customer requirements under controlled conditions |
| Thermal Shock Test Chamber | Provides extreme low and high temperature environments | Tests for delamination and abnormalities in substrate and insulating layers |
| Plating Thickness Tester | Measures plating layer thickness | Measures gold plating, chemical gold, and other surface treatment thicknesses |
| XRF Analyzer | Harmful substance detection | Tests harmful substances in FPC raw materials, semi-finished, and finished products |
| Salt Spray Tester | Provides stable acidic environment | Tests product corrosion resistance |
| Impedance Tester (KEYSIGHT) | Impedance measurement capability | Measures FPC characteristic impedance and differential impedance to meet customer requirements |
| Copper Thickness Tester | Measures thickness of FCCL and circuit patterns | Measures copper layer and circuit pattern thickness |
| Atomic Absorption Spectrometer (AA) | Elemental analysis capability | Analyzes Au, Cu, Ag, Fe, Ni, Pb and other elements in plating bath solutions |
| 2.5D Measuring System | High-precision dimensional measurement | Measures height, width, thickness, and distances between irregular shapes |
| Metallographic Microscope | Microscopic examination capability | Measures FPC cross-sections and hole wall thickness |
| Bending Test Machine | Programmable bending cycles | Tests FPC bending life according to customer-specified angles and requirements |
| Peel Strength Tester | Adhesion strength measurement | Tests bonding strength between substrate/copper foil/adhesive layers |
Materials We Use
We work with a stable and proven material system that supports reliable FPC production and downstream SMT assembly. All base films, copper foils, adhesives, surface finishes and stiffeners are sourced from vetted suppliers and checked upon arrival to ensure consistency before entering the line. Each material category plays a specific role in achieving dimensional accuracy, solderability and long-term reliability, especially for applications that demand high mechanical flexibility or environmental resistance.
The table below outlines the primary materials used across our processes, covering everything from core substrates to protective films and finishing options. This provides a clear view of the material structure behind our products and the standards we maintain throughout manufacturing.
Manufacturing Process & Production Control
CNTCOM operates a fully integrated manufacturing process supported by comprehensive production and testing equipment across FPC fabrication and SMT assembly. Dedicated machinery is used throughout fabrication, surface finishing and protective lamination to maintain accuracy, process stability and repeatable output. Automated inspection and electrical verification are embedded within the production flow, allowing quality to be monitored and controlled at multiple stages.
Quality assurance is applied through two dedicated FQC and FQA checkpoints, covering both pre-assembly and post-assembly stages. This layered inspection approach helps identify potential issues early and ensures that finished products meet defined electrical, mechanical and performance requirements before shipment. Combined with final functional testing and profiling, this structured quality control framework supports consistent results across prototypes and long-term volume production.
Sample & Mass Production Delivery
CNTCOM provides flexible production services from quick-turn prototypes to high-volume manufacturing. Our streamlined processes and experienced team deliver consistent lead times across all FPC types, ensuring your projects stay on schedule from initial sampling through mass production.
Sample Production Cycle
| FPC Type | Production Cycle (Days) | Molding Method |
|---|---|---|
| Single Sided Flex Board | 7 | Steel mould or Worker assemble |
| Single Sided Flex Board | 5 | Laser cutting |
| Single Sided and Double Layer Flex Board | 8 | Steel mould or Worker assemble |
| Single Sided and Double Layer Flex Board | 6 | Laser cutting |
| Multilayer Flex Board | 12 | Steel mould or Worker assemble |
| Multilayer Flex Board | 10 | Laser cutting |
| Rigid-Flex | 15 | Laser cutting and V-cut |
Mass Production Cycle
| FPC Type | Production Cycle (Days) | Molding Method |
|---|---|---|
| Single Sided Flex Board | 10 | Steel mould |
| Single Sided and Double Layer Flex Board | 12 | Steel mould |
| Multilayer Flex Board | 15 | Steel mould |
| Rigid-Flex | 20 | V-cut and Steel mould |