FPC + SMT Integrated Solutions
Complete Manufacturing — From Design to Delivery
From Flexible Circuits to Finished Assemblies
CNTCOM provides fully integrated FPC and SMT solutions designed to simplify sourcing, improve quality consistency and shorten time to market. By combining flexible circuit manufacturing with in-house SMT assembly under one production system, we support customers from early design through to stable mass production — all within a single, coordinated workflow.
This integrated approach allows us to manage both circuit fabrication and component assembly with greater control, reducing interface risks, communication gaps and lead-time uncertainty that often arise when processes are split across multiple suppliers.
| Advantage | CNTCOM Integrated Approach |
|---|---|
| Streamlined Production | Complete FPC fabrication and SMT assembly under one roof Eliminates shipping delays between separate facilities Single quality management system throughout production |
| Enhanced Quality | Full traceability from raw materials to finished assemblies Consistent process control across all manufacturing stages Continuous flow inspection: AOI, X-ray, and functional testing |
| Faster Time-to-Market | Shorter lead times without inter-facility logistics Parallel processing for simultaneous FPC and component preparation Rapid response to design modifications |
| Unified Engineering | Single engineering team manages both FPC design and assembly Comprehensive design-for-manufacturing optimization Coordinated material and component compatibility |
| Cost Efficiency | Lower logistics and handling costs Reduced inventory holding requirements Volume purchasing power for materials and components |
End-to-End Solution Support
Customised Design & Manufacturing
Every project is treated as a tailored solution rather than a standard build.Our FPC + SMT integrated solutions cover the full product lifecycle, from concept validation to volume delivery. By aligning FPC fabrication and SMT assembly internally, we ensure dimensional accuracy, solder reliability and electrical performance are consistently maintained across both processes.
Our engineering and production teams work closely with customers to support custom requirements such as:
Flexible circuit structure and layer configuration
Stiffener selection and reinforcement design
Surface finish and soldering compatibility
Assembly method optimisation for flexible substrates
Product form factor, bending zones and connection points
This customisation capability allows CNTCOM to support a wide range of applications, from consumer electronics and industrial control modules to automotive and medical devices.
| Solution Stage | FPC Scope | SMT Scope |
|---|---|---|
| Design & Engineering Support | Circuit structure, layer design, bending zones | Assembly method, layout optimisation |
| Material & Component Preparation | Base materials, stiffeners, surface finish | Component sourcing & verification |
| Manufacturing | FPC fabrication & profiling | SMT placement & reflow |
| Inspection & Testing | Electrical testing, AOI | AOI, X-ray, functional testing |
| Quality Control | In-process QA, pre-assembly FQC | Post-assembly FQC & FQA |
| Delivery | Sample & mass production | Sample & mass production |